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Suite of analysis reports enabling operators & engineers to efficiently correlate different test runs of data against each other. The report enables instant identification of yield issues in cases where wafers & final testing occurs in multiple manufacturing & test sites. Quickly able to ensure that there are no test program or test equipment related issues when setups or test program changes are made. Saves valuable yield and test time. The reports support both Parameter-to-Parameter correlation as well as Bin correlation. T-Test is one of the options available in both report types. |
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