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Zonal Yield Reporting- Study which regions of the wafer have yield issues, and instantly identify and differentiate between random and systematic yield problems.
yieldWerx enables you to define the zones of interest, prior to running the analysis. |
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Wafer Probe Correlation & Analysis Reports -> Suite of analysis reports enabling operators & engineers to efficiently correlate different test runs of data against each other. The report enables instant identification of yield issues in cases where wafers & final testing occurs in multiple manufacturing & test sites.
Quickly able to ensure that there are no test program or test equipment related issues when setups or test program changes are made. Saves valuable yield and test time.
The reports support both Parameter-to-Parameter correlation as well as Bin correlation. T-Test is one of the options available in both report types. |
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Full Wafer Correlation - In this case the wafer is probed on the initial tester in its entirety. The STDF file is loaded to yieldWerx and marked as the base line data or ‘golden’ data. The wafer is then retested on the second tester, again in its entirety, and the resulting STDF file loaded to yieldWerx.
The newly loaded STDF file is then analyzed in light of the baseline data, and compared to see whether or not the data correlates.
Allows the user to generate multiple analysis reports, and take appropriate actions. |
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Partial Wafer Correlation
- This is similar to the Full Wafer Correlation & Analysis Report, but takes into account that the wafer can be probed at any point. Because correlation wafers or die can only be probed a certain number of times before probe marks on the probe pads become an issue, operators are limited to only probe portions of the wafer. These partial probe results are then compared with the baseline data to see if the data correlates. This report extends the life of a correlation wafer, as well as cuts down on test time when performing correlation runs. |
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Final Test Data Correlation & Analysis Reports -> This report is similar in nature to Wafer Correlation and Analysis Reports, but has been developed to do the same for Final Packaged Units. For example: The tester will be running in final test mode, and may be performing single or dual site testing. Some golden units are identified to be used for the correlation run. For example there are 4 units that are going to be used for correlation purposes in single site test mode. The 4 units will be tested and have 50 tests performed on them, on both testers. 2 of the resulting STDF files will have data for the 5 units and 50 test parameters. If the units are cycled through more than once, the unit number will just be incremented by 1. The reports and analysis routines then check and compare the resulting BIN, SOFTBIN and test parameters for the same die across the two STDF files. If there are any discrepancies, these will be highlighted in the report. |
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Yield Analysis Reports - yieldWerx enables Product Engineers to identify yield losses due to potential problems with test related equipment. These could range from tester setup related issues to probe card or load board related issues.
yieldWerx Analysis Reports highlights yield variations for wafers from the same lot, and final test units from the same lot, across different test equipment.
The reports can be used to highlight issues for lots & wafers of the same device, that are being tested using the same test algorithms (i.e. not necessarily the same lot).
The reports can also be used to identify site & socket issues when testing multi site. Example: sites 1–3 are yielding, but site 4 is always failing.
Saves valuable yield and test time. Improves quality; die & units can be binned incorrectly. Reports can be automatically run highlighting issues that can cause the engineer & operator to stop the tester, and make the corrections, re-probe the wafers & units, and recover yield. |
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Prober to Prober
Probe Card to Probe Card
Load Board to Load Board
Site to Site |
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yieldWerx Database
- Easily upload hundreds of STDF test data files from
across Work Centers, Test Programs, Lots, and Wafers,
and run reports that compare test results across Wafers
and Lots. Simple Windows drill down capabilities allow
you to maintain your Die and Wafer Genealogy. |
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Parametric Wafer Map -
You can
generate wafer maps for test parameters and visually see
the distribution of results by die location. The report
can aggregate data from multiple wafers and stack them for
cross wafer or lot analysis. The report can also be run
for parametric zonal analysis simply by sorting results by
wafer. The report can be used for both Parametric as well
as Functional test parameters. Options exist to
screen/filter data based on Tukey and user defined limits.
[Applicable to only Wafer Probe Data] |
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Stacked Wafer Map -
This
report is similar to the single wafer map report, however
instead of showing the wafers as individual maps, the
output is a stacked map representation of all the wafers
for either Bins or Soft Bins. The report can be run for
multiple wafers and multiple lots. You can then drill down
to the raw data by selecting any of the die on the wafer.
[Applicable to only Wafer Probe Data] |
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Wafer Map -
This
report visually generates a representation of a wafer
showing either Bins or Soft Bins. The report can be run
for multiple wafers and multiple lots. , The output of the
reports can be aggregated by bin population/wafer yields
by wafer, lot, or test program. You can compare multiple
wafer maps using the wafer map thumb nail galleries to see
if there are any repeating patterns across wafers.
[Applicable to only Wafer Probe Data] |
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Parametric Histogram -
Generates histograms for a given test parameter and
represents the data as a series of classes. The report can
aggregate data from multiple wafers and stack them for
cross wafer or lot analysis. The report can be used for
both Parametric as well as Functional test parameters.
Options exist to filter data based on Tukey, user defined
limits, as well as user definable classes for the data.
[Applicable to both Wafer Probe as well as Final Test
Data] |
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Bin Histogram -
This
report allows you to generate Bin summaries for both Wafer
probe data as well as Final Test Data based on Bins, Soft
Bins, as well as User Defined Bin Groups. The report shows
you the yield for the selected data as well as other
statistics as a series of bar charts. You can run the
report for a single data set, or for a series of selected
lots/wafers. [Applicable to both Wafer Probe as well as
Final Test Data] |
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Stacked Bin Histogram -
This
report allows you to generate Bin summaries for both Wafer
probe data as well as Final Test Data based on Bins, Soft
Bins, as well as User Defined Bin Groups. The report shows
you the yield for the selected data as well as other
statistics as a series of stacked histograms. You can run
the report for a single data set or for a series of
selected lots/wafers. [Applicable to both Wafer Probe as
well as Final Test Data] |
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Box Plots -
This
report allows you to select two parameters and plot them
against each other for as many wafers/lots as you select.
The data plotted provides visualizations to see if there
is any correlation between the two. Again users are
allowed to select limits and apply filters as needed.
[Applicable to both Wafer Probe as well as Final Test
Data] |
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Parametric Trend -
This
report allows you to generate trend charts for either a
single parameter or groups of parameters where the units
of measurements are similar. Graphically allows you to
visualize trends/relationships as well as other key
statistics. The report can be run for a single data set or
a series of lots/wafers. You can filter, as well as group,
data with a wide range of options [Applicable to both
Wafer Probe as well as Final Test Data] |
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Data Reports:
Parametric
Failure Report -
A very
simple report that shows you the top most failing tests
based on limits included in the data source or user
specified. Useful for showing you what tests are failing
the most and for you to take corrective action on -
conversely you can also see which tests are failing the
least and decide to modify the test program to take the
non critical ones out to save test times. [Applicable to
both Wafer Probe as well as Final Test Data]
Data Extraction:
This report allows you to select any of the test data
points stored in the yieldWerx database and then extract
the data into a table which can then be exported to Excel
for further manipulation and analysis. You can select as
many parameters, wafers and lots as you want.
[Applicable to both Wafer Probe as well as Final Test
Data]
Data Summary:
Statistically analyze the results for any test
parameter, and view the Mean, Standard Deviation, Cp,
Cpk, Yield, and other statistical results for selected
test parameters, wafers and or lots. [Applicable to both
Wafer Probe as well as Final Test Data] |
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XY Scatter -
This
report allows you to select two parameters and plot them
against each other for as many wafers/lots as you select.
The data plotted provides visualizations to see if there
is any correlation between the two. Again users are
allowed to select limits and apply filters as needed.
[Applicable to both Wafer Probe as well as Final Test
Data] |
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Smart Labels - Smart
Data Labels allow for access to detailed data on the die
plotted, without cluttering the graph too much. |
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Technology: yieldWerx
is developed with Microsoft .Net Technology
Database:
Powered by Microsoft SQL Server Database
Export Reports to Microsoft Excel. You can export results
to Microsoft Excel from any yieldWerx Report |
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Interactive Charts. yieldWerx
Interactive Reports allow you zoom in/out on reports,
drill down into test parameter results for a die by clicking
on the wafer map, and visually grouping the data by lot
or wafer |
