|
|||||||
 |
This report is similar in nature to Wafer Correlation and Analysis Reports, but has been developed to do the same for Final Packaged Units. For example: The tester will be running in final test mode, and may be performing single or dual site testing. Some golden units are identified to be used for the correlation run. For example there are 4 units that are going to be used for correlation purposes in single site test mode. The 4 units will be tested and have 50 tests performed on them, on both testers. 2 of the resulting STDF files will have data for the 5 units and 50 test parameters. If the units are cycled through more than once, the unit number will just be incremented by 1. The reports and analysis routines then check and compare the resulting BIN, SOFTBIN and test parameters for the same die across the two STDF files. If there are any discrepancies, these will be highlighted in the report. |
||||||
| |||||||
|