Yield Analysis Reports

yieldWerx enables Product Engineers to identify yield losses due to potential problems with test related equipment. These could range from tester setup related issues to probe card or load board related issues.
yieldWerx Analysis Reports highlights yield variations for wafers from the same lot, and final test units from the same lot, across different test equipment.
The reports can be used to highlight issues for lots & wafers of the same device, that are being tested using the same test algorithms (i.e. not necessarily the same lot).
The reports can also be used to identify site & socket issues when testing multi site. Example: sites 1–3 are yielding, but site 4 is always failing.
Saves valuable yield and test time. Improves quality; die & units can be binned incorrectly. Reports can be automatically run highlighting issues that can cause the engineer & operator to stop the tester, and make the corrections, re-probe the wafers & units, and recover yield.